Bonding

# Status Description
2017248560 Filed Semiconductor device and manufacturing method for the semiconductor device
2017201728 Filed Positively charged water-soluble prodrugs of 1H-imidazo[4,5-c]quinolin-4-amines and related compounds with very high skin penetration rates
2017203249 Filed Apparatus and method of manufacturing pressure compensator type drip irrigation tubes with desired molecular orientation and tubes obtained thereby
2017200688 Filed Science educational atom model kit
2017203617 Filed Method and composition for managing dag on hair
2007362867 Granted A seam joining together at least two web materials
2006340403 Granted Laminated paper article and paper web
2000059406 Lapsed Polychloroprene/disocyanate adhesive system, wherein in the chloroprene rubber solution n-propylbromid is used as solvent
2005327899 Granted Method of bonding substrates
2006240526 Granted Method and device for multi -roll bonding and a diaper obtainable by said method
2005203437 Lapsed Transient liquid phase bonding using sandwich interlayers
2006346077 Ceased A seam joining together at least two web materials
2008292429 Lapsed Substituted pyrazole derivative
1991090718 Ceased Building member
2001293747 Lapsed Method and device for characterising and/or for detecting a bonding complex
2006338414 Ceased Bolt for projection welding and method of welding the same
2008305279 Lapsed Absorbent article
2009237048 Granted Cleaning sheet and process for producing the same
2009280036 Granted Abrasive tools having a continuous metal phase for bonding an abrasive component to a carrier
2010224301 Granted Artificial eyeflash structure and its fabrication and method of use